US HB5287

Secretary of Defense must submit annual reports to the House and Senate Armed Services Committees on China's semiconductor manufacturing capabilities, starting May 1, 2026 and continuing for 5 years

Reports must assess China's domestic semiconductor capabilities, industrial policies, and year-by-year technological development in semiconductor manufacturing and AI chipmaking, covering design, IP, R&D, materials, equipment, and packaging

Reports must analyze China's international semiconductor partnerships, joint ventures, and foreign investment ties, as well as coordination with other countries to expand semiconductor influence

Reports must evaluate the effectiveness of U.S. and allied export controls on China's semiconductor development, including workarounds, loopholes, and circumvention through third-party acquisitions

Reports must be submitted in unclassified form with a classified annex, and the unclassified portion must be published on a public government website with notice in the Federal Register