US HB6058

Directs the Secretary of State to coordinate with allied nations that have significant semiconductor capabilities to establish multilateral approaches for protecting critical chip technologies from acquisition by China and other foreign adversaries

Requires alignment of export control policies on semiconductor manufacturing equipment including lithography systems, deposition equipment, etching tools, and inspection systems, as well as restrictions on design tools, IP transfers, and technical assistance

Establishes consequences for non-cooperating allied countries, including detailed deficiency reports, Export Advisory Review Board action plans within 21 days, and potential application of Foreign Direct Product Rule restrictions to their semiconductor exports

Mandates quarterly reports to Congress (every 90 days) on diplomatic engagement progress, coordination objectives, determinations of inadequate cooperation, and effectiveness of multilateral coordination in preventing technology transfer

Defines semiconductor technology broadly to include integrated circuits, manufacturing equipment and components, design software, specialty materials and chemicals, and testing/packaging equipment